Pyramid Engineering

• Cold Welding
• Laser Welding
• Nitrogen Glovebox

• Resistance Welding
• Seam Sealer
• Hermetic Welding

• Film Stress
• Film Adhesion
• 3DIC TSV Process Control
• Thin wafer metrology
• Electrical Characterization
• Low Coherence Interferometry
• Laser Scanning
• Raman Spectroscopy

PTC CUTTER

• High-speed cut – Up to 6 cuts/s
• High-accuracy cut – Up to ± 0.005 mm
• Automatic loading and unloading of tapes
• Patented one-click blade change mechanism
• Automatic stripper debris cleaning
• Post-processed tungsten blade

e_Pak Wafer

• 1"/1.5"/2"/2.5"/3"/3.25"/3.54"
• 4"(100mm)/5"(125mm)/6"(150mm)/8"(200mm)
• 12"(300mm)/18"(450mm)
• Internal Canister/Jar Cushioning
• Film / Flex Frames
• Grip / Hoop Rings
• Chip Trays
• Bags

CIONE (LF) Plasma Processing System

• Modle - CIONE4/ CIONE6/ CIONE8
• Generator - 20-100KHz (Max. 100W-500W)
• MFC - Max. (100sscm - 500sscm)
• Gauge Pressure - Atm ~5 x 10^-4Torr
• Operation - Manual & Automatic

BD-6 Probe Station

• Large Knob High Precision Stage
• Back-lash free movement
• Mounting for 12 micropositioners
• 4.5” Probe Card Holder compatible
• Platen Height Adjustable
• Micropositioner Standby Dock
• Microscope Tilting for E-Z lens switching

I-PEX TS-PRO

• Cost-Down Effect
• Cu-Wire Improvement
• M/C Cycle Time : 25sec~35sec
• (Heat Up Time : 150~180sec)
• Conversion Time : 10min./Person

JFP PP6 Universal Die Bonder

• All process
• Face up and Face Down
• Z control
• XYZ Automated Process
• Multiple Process
• Programmable X&Y positions
• Very high accuracy